Current Headlines

  1. Rigaku Introduces Two Innovations In Semiconductor Metrology At ICSCRM 2025 9/12/2025

    Rigaku Corporation, a global leader in X-ray analytical instrumentation, will present two breakthrough platforms at the International Conference on Silicon Carbide and Related Materials (ICSCRM) in Busan, Korea.

  2. Aeva Unveils Eve 1V High-Precision, Non-Contact Motion Sensor For Next-Generation Manufacturing Automation 9/10/2025

    Aeva, a leader in next-generation sensing and perception systems, today announced the introduction of Aeva Eve 1V, a high-precision, non-contact motion sensor with the potential to redefine industrial speed, length, and position measurement wherever traditional encoders and tactile sensors are used in manufacturing today.

  3. Medical Manufacturing Technologies (MMT) Unveils The Glebar P5K Gauging System: Revolutionizing Guidewire Measurement And Metrology Processes With Unmatched Speed And Accuracy 9/9/2025

    Medical Manufacturing Technologies (MMT), a leading global provider of medical device manufacturing services and solutions, proudly announces the launch of the ground-breaking, patented Glebar P5K Gauging System.

  4. Onto Innovation Launches Next Generation OCD Metrology Platform To Enable Process Control For Advanced AI Devices 9/9/2025

    Onto Innovation Inc. today introduced the Atlas G6 optical critical dimension (OCD) metrology system, designed to address the growing complexity of process control in advanced semiconductor nodes.

  5. Advantest Introduces Advanced Mask CD-SEM 'E3660' 9/9/2025

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the release of its next-generation CD-SEM* E3660, engineered for the dimensional metrology of photomasks and EUV masks used in cutting-edge semiconductor manufacturing.

  6. EV Group Achieves Breakthrough In Hybrid Bonding Overlay Control For Chiplet Integration 9/8/2025

    EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments.

  7. ReLogic Research Launches ReLogic3D, Bringing Metrology-Grade 3D Scanning Solutions To U.S. Industries 9/5/2025

    ReLogic Research today announced the launch of ReLogic3D, a new distribution and solutions company making high-precision 3D scanning technology more accessible to U.S. industries.

  8. Mitutoyo Introduces Sensible Measurement For Everyone With The New Bold Compact QM-Fit Measurement System 9/4/2025

    Mitutoyo America Corporation, the world leader in metrology instruments, introduces the QM-Fit Smart Vision System. The QM-Fit represents a BOLD step forward in optical metrology.

  9. Koh Young Showcases Advanced Dimensional Metrology And Inspection Solutions For Semiconductor And Wafer-Level Packaging At SEMICON West 9/3/2025

    Koh Young Technology, the industry leader in True 3D measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.

  10. GaN-Based e-Beam Inspection And Metrology Co-Developed By Startup Photo Electron Soul Inc. And Nagoya University Will Be Evaluated By Kioxia, A Leading Flash Memory Producer 9/1/2025

    It was announced today that GaN (Gallium Nitride)-based e-Beam inspection and metrology for advanced semiconductor manufacturing, jointly developed by Nagoya University startup Photo electron Soul Inc. (PeS; CEO: Takayuki Suzuki) and the Nagoya University Amano-Honda Laboratory, will be evaluated by Kioxia Iwate Corporation (President and CEO: Koichiro Shibayama) in late September.