Latest Headlines

  1. X-Rite Unveils Comprehensive Color Measurement Solutions For A Sustainable Packaging Workflow At INFOFLEX 2023 3/20/2023

    At INFOFLEX 2023, April 17-18, in Columbus, Ohio, X-Rite Incorporated and Pantone LLC, will showcase a connected ecosystem of color measurement solutions to transform the flexographic and packaging color workflow process.

  2. Picarro's New 1-ppb Class Chemical Metrology Solution For Lithography Process Tool Monitoring Enables Semiconductor Fabs To Improve Process Control 3/14/2023

    Picarro Inc., a leading provider of chemical metrology systems for advanced semiconductor fabs, today announced the SLiM 100 Lithography Process Tool Monitoring System.

  3. Saelig Introduces Siglent SNA5000A Vector Network Analyzer Range Expanded To 26.5GHz 2/28/2023

    Saelig Company, Inc. has introduced two new models in the Siglent SNA5000A Vector Network Analyzers range – 13.5GHz and 26.5GHz. The extended SNA5000A network analyzer range is offered as 2- or 4-port devices with frequency ranges from 9 kHz to 4.5GHz or 8.5GHz and from 100kHz to 13.5GHz or 26.5GHz, with a resolution of 1Hz, a dynamic range of 125dB, and a level resolution of 0.05dB.

  4. Applied Materials’ New eBeam Metrology System Paves The Way To High-NA EUV Lithography 2/28/2023

    Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.

  5. Infinitesima Announce First Metron3D Customer Shipment 2/28/2023

    Infinitesima announce first customer shipment of their ground-breaking Metron3D in-line probe metrology system, providing improved process control for next generation Semiconductor manufacturing.

  6. Hexagon’s Digital Reality Platform, Nexus, Is Now Available To Manufacturers – Putting An End To Silos And Enabling Faster Innovation 2/23/2023

    Hexagon’s Manufacturing Intelligence division has launched its digital reality platform, Nexus. Announced earlier today, the new platform applies the latest cloud technologies to unblock innovation bottlenecks, enabling global teams to collaborate in real-time across the product lifecycle – from design and engineering to production and quality – to solve design and manufacturing problems together and accelerate time to market.

  7. Geometry And Stress Calculation Of Hirth Couplings 2/23/2023

    KISSsoft offers the calculation of geometry and contact stresses of Hirth couplings. Hirth couplings allow for the transmission of high torque between shafts. In KISSsoft, users can select a standard Hirth coupling offered by Voith GmbH & Co. KGaA or enter their own custom geometry for the calculation.

  8. Fractilia Brings Stochastics Metrology To HVM Fabs To Improve EUV Patterning Control And Yields 2/21/2023

    Fractilia, the leader in stochastics metrology and control solutions for advanced semiconductor manufacturing, today announced the latest addition to its Fractilia Automated Measurement Environment (FAME™) portfolio, the FAME 300. Designed specifically for use in high-volume manufacturing (HVM) fab environments, the FAME 300 provides real-time measurement, detection and monitoring of stochastic effects, which are the single largest source of patterning errors at advanced nodes.

  9. New Canon Wafer Measurement Equipment Improves Productivity Of Lithography Systems, Enabling High-Precision Alignment For Increasingly Complex Semiconductor Manufacturing Processes 2/21/2023

    Canon Inc. announced today the launch in Japan of the MS-001, a high-precision wafer alignment1 measurement device for semiconductor lithography systems.

  10. Vaisala Launches A Pioneering Optical Inline Process Refractometer Series For Industrial Liquid Measurements 2/15/2023

    The new robust platform of inline process refractometers adds to Vaisala’s leading-edge innovations by introducing the first fully inhouse developed refractometer series to product platform that combines both liquid and gas measurement capabilities.