Rigaku Introduces Two Innovations In Semiconductor Metrology At ICSCRM 2025

Rigaku Corporation, a global leader in X-ray analytical instrumentation, will present two breakthrough platforms at the International Conference on Silicon Carbide and Related Materials (ICSCRM) in Busan, Korea. The XTRAIA XT Series and XTRAIA TF Series expand Rigaku’s semiconductor metrology portfolio, advancing its Lab-to-Fab strategy for compound semiconductors.

XTRAIA XT Series – Next-Generation X-ray Topography
The XTRAIA XT is Rigaku’s latest X-ray topography system, purpose-built for quality control in silicon carbide (SiC) wafer and device manufacturing. The platform provides fast, non-destructive detection of basal plane dislocations (BPD) and threading screw dislocations (TSD), enabling fabs to reduce yield loss and improve device reliability.

• Comprehensive wafer mapping of BPD and TSD.
• Compatible with automation in cleanrooms (equivalent to ISO Class 6)
• SEMI S2/S8 and GEM300 compliance for fab-ready automation.

XTRAIA XT-3000 is optimized for up to 300 mm wafers.

XTRAIA TF Series – Fab-Ready Thin Film Metrology
The XTRAIA TF Series sets a new benchmark for thin film characterization with non-destructive, full-wafer XRD mapping of thickness, crystallinity, strain, and relaxation. Supporting both 200 mm and 300 mm wafers, it integrates seamlessly into production while retaining research-level flexibility.

• Full-wafer uniformity maps for epitaxial and multi-stack films.
• Crystal strain monitoring to prevent process drift.
• High-speed scans with HyPix 2D detectors.
• Compatible with automation in cleanrooms (equivalent to ISO Class 6)
• SEMI S2/S8 and GEM300 compliance for fab-ready automation.

Available models include the XTRAIA TF-2000 (200 mm) and XTRAIA TF-3000 (300 mm).

Rigaku at ICSCRM 2025
Rigaku will showcase its end-to-end metrology portfolio at Booths 213 & 224, covering every stage of compound semiconductor manufacturing:

• Substrate process: FSAS III, XTRAIA XT Series, TXRF 3760, TXRF 310Fab.
• Epitaxial process: SmartLab, XTRAIA TF Series.
• Device process: ONYX 3000, WDA-3650, WaferX 310, XHEMIS EX-2000.

With the lineups, Rigaku reinforces its role as a trusted partner in enabling SiC and compound semiconductor (https://rigaku.com/resources/application-notes/semiconductors/compound-semiconductors) manufacturers to scale production, control variability, and bring next-generation devices to market with confidence.