Nordson Test & Inspection To Demonstrate Leading Edge Inspection And Metrology Technologies With Advanced AI At APEX EXPO 2026

Nordson Test & Inspection will showcase its latest optical, X ray, acoustic inspection, and metrology solutions in Booth 1831 at the 2026 IPC APEX EXPO, taking place March 17–19 at the Anaheim Convention Center. The company will feature several technology advancements for electronics manufacturing and semiconductor back-end, that improve yields, processes and productivity.

Introducing the SQ5000Pro Multi-Function System
Making its first appearance in the Americas, the SQ5000Pro Multi-Function system delivers AOI, SPI, and CMM capabilities in a single platform. Designed for high accuracy, in line or off-line inspection and measurement, the system captures critical metrology parameters in seconds using a comprehensive coordinate measurement software suite. The system also features a new advanced AutoProgram, part of the Nordson Intelligence ecosystem, which significantly accelerates program creation and reduces operator interaction.

Powered by the new 500 series Multi Reflection Suppression (MRS) HR and HS sensors, the SQ5000Pro provides exceptional speed and accuracy. MRS technology eliminates reflection based distortions common with shiny and specular surfaces, ensuring reliable inspection across applications including advanced packaging, advanced SMT, 0201 metric components, socket metrology, and other high precision requirements.

SQ7000+ Multi-Function System for Next-Generation Applications
Nordson will also demonstrate the SQ7000+ Multi-Function system, engineered for high speed, high accuracy inspection and metrology with an even-higher resolution MRS sensor. It is an ideal solution for advanced packaging, mini and micro LED, automotive, medical, aerospace, military, and other high reliability electronics. The SQ7000+ supports fine feature inspection—including 008004/0201 solder paste inspection—and advanced coordinate measurement applications such as socket metrology.

SQ3000M2 for Microelectronic and Wirebond Applications
The SQ3000M2 Inspection and Metrology system, designed for micro-electronics applications including wire bonds, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities.

Dynamic Planar CT: Next-Generation 3D Planar X-Ray
The company’s Dynamic Planar CT software brings major advancements to Automated X Ray Inspection (AXI). Using a new 3D reconstruction algorithm, it delivers superior data quality, sharper layer separation, and exceptional defect visibility.

Optimized for 3D electronics inspection—and especially powerful for semiconductor applications like flip chip micro bump inspection—Dynamic Planar CT will be showcased on the X3 AXI system. The latest release provides a larger field of view and up to 2× faster image acquisition compared to classical Planar CT, enabling higher throughput and reduced radiation dose.

QuadraPro MXI: Redefining Manual X-Ray Inspection
Setting a new benchmark for 2D/3D manual X ray inspection in SMT & back end semiconductor applications, the QuadraPro features Nordson’s Onyx detector for exceptional image clarity and precision. Its Dual Mode Quadra NT4 tube allows seamless switching between brightness and resolution modes, giving operators the flexibility needed to optimize results for diverse inspection tasks.

Gen7 AMI for Acoustic Microscopy
The Gen7 AMI system, powered by C SAM technology, provides fast, highly accurate detection of delamination, voiding, and other internal defects. It is ideal for lab analysis and high resolution applications requiring the most advanced acoustic microscopy performance.

Additional systems demonstrated include:

• Assure X-Ray Component Counter – Eliminates production line downtime with fast, accurate component inventory verification.
• 4800 Bond Test System – Provides automated bump shear testing for advanced quality control.

Advancing ML, DL, and AI Within the Nordson Intelligence Ecosystem
Nordson Test & Inspection continues to lead in Machine Learning (ML), Deep Learning (DL), and Artificial Intelligence (AI) through its expanding Nordson Intelligence ecosystem.

Key innovations include:

• Nordson AI-Hub – A stand alone ML platform for creating ground truth labels, training models, and enabling continuous model improvement.
• Nordson Sight – A complete SPC solution offering machine level to factory level capability, historical analysis, reporting tools, and full traceability to improve process control and yields.
• Automated Intelligence Tools Across Platforms – Including AutoProgram for AOI, AutoGrade for Bond Test, AutoReview for AXI, BGA Void for MXI, and Multi Gate Image Analysis (MGIA) for Acoustic Inspection.

Visit Nordson Test & Inspection in Booth 1831 to see live demonstrations and learn how Nordson’s solutions can support next-generation electronics manufacturing – all to improve yields, processes and productivity.