CyberOptics Semiconductor Rolls Out 450 mm Line Of Wireless Wafer Processing Metrology Sensors After Interest In Prototypes
Wilsonville, OR--(Marketwire) - The R&D group at CyberOptics Semiconductor has signed off on a line of wireless 450 mm wafer processing metrology sensors developed in conjunction with industry standards to help chipmakers and tool manufacturers qualify next-generation production processes.
CyberOptics' 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances, according to Craig C. Ramsey, Ph.D., CyberOptics Semiconductor's general manager.
Ramsey said CyberOptics engineers have communicated with representatives of the International SEMATECH Manufacturing Initiative (ISMI) in developing the 450 mm devices for inclusion in ISMI's 450 mm Interoperability Test Bed -- where industry researchers have been studying 450 mm wafers and equipment. ISMI's 450 mm roadmap calls for three chipmakers to build 450 mm pilot lines by 2012.
"The 450 roadmap is starting to heat up, and 32 nm tolerances will require equally tight metrology controls for viable processing," Ramsey said.
CyberOptics' 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.
The Company's line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).
Prototypes of CyberOptics' 450 mm sensors, most recently the ATS450, "have really been quite well-received by engineers and the standards community," Ramsey said.
Ramsey added that data from fabs indicate that the Company's 300 mm and 200 mm form factor WaferSense sensors help engineers "improve yield, reduce downtime and set reproducible process controls."
Engineers implement CyberOptics' WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.
CyberOptics plans to eventually develop a 450 mm form factor Auto Gapping System (AGS) and Airborne Particle Sensor (APS).
450 mm WaferSense® Auto Teaching System (ATS450):
The 450 mm WaferSense ATS' key specifications and features include reporting wafer offsets in three dimensions, an accuracy of +/-0.1 mm (X and Y positions) and +/0.5 mm (Z position), measuring offsets to targets 6.5 mm to 45 mm below the device, operating temperature of 20 to 50 degrees Celsius, height of 6.3 mm, wireless Bluetooth® link, more than two hours run time per battery charge, companion TeachView™, TeachReview™ and TeachTarget™ software and use with Microsoft® Windows® 2000, Windows XP and Windows Vista®.
450 mm WaferSense® Auto Leveling System 2 Vertical (ALS2V450):
The 450 mm WaferSense ALS2V's key specifications and features include reporting tilt in two dimensions, vertical accuracy of +/-0.05 degrees within +/-50 degrees from vertical, horizontal accuracy of +/-0.03 degrees within +/-4 degrees from absolute, resolution of +/-0.002 degrees, operating range of +/-14 degrees from absolute, vacuum compatible, operating temperature of 20 to 30 degrees Celsius, height of 6.3 mm, weight of 450 gm, wireless Bluetooth link, four hour run time per battery charge, companion LevelView™ and LevelReview™ software and use with Microsoft Windows 2000, Windows XP and Windows Vista.
450 mm WaferSense® Auto Vibration System (AVS450):
The 450 mm WaferSense AVS' key specifications and features include reporting acceleration in three dimensions, range of +/-2 G, resolution of +/-0.01 G, frequency response 0-200 Hz, -3 dB, operating pressure of less than 10 -6 to 760 Torr, operating temperature of 20 to 70 degrees Celsius, height of 6.3 mm, weight of 450 gm, wireless Bluetooth link, more than four hour run time per battery charge, companion VibeView™ and VibeReview™ software and use with Microsoft Windows 2000, Windows XP and Windows Vista.
About CyberOptics Semiconductor, Inc.
CyberOptics Semiconductor develops automated products that seamlessly measure critical parameters in semiconductor fabrication processes and equipment. The Company's pioneering WaferSense® line includes wireless metrology devices for vibration, leveling, gapping, teaching and sensing airborne particles in semiconductor process equipment. The Company is the largest producer of reflective wafer-mapping sensors and a leading provider of frame grabber machine vision boards under its HAMA Sensors™ and Imagenation™ brands. CyberOptics Semiconductor is a subsidiary of CyberOptics Corporation (NASDAQ: CYBE), one of the world's leading providers of process yield and throughput improvement solutions for the electronic assembly and semiconductor fabrication industries. For information, visit http://www.cyberopticssemi.com/, e-mail CSsales@cyberoptics.com or call 800-366-9131.
Statements regarding the Company's anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the impact of current economic conditions on the Company's performance; the timing and magnitude of any potential recovery in financial performance resulting from the global economic downturn; the need for a valuation allowance with respect to our deferred tax assets; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the timing of and our ultimate ability to return to profitability in 2010; success of anticipated new OEM and end user opportunities and other factors set forth in the Company's filings with the Securities and Exchange Commission.
CyberOptics and WaferSense are either registered trademarks or trademarks of CyberOptics Corporation or its subsidiaries in the United States and/or other countries. Microsoft, Windows and Microsoft Vista are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Bluetooth is either a registered trademark or trademark of Bluetooth SIG in the United States and/or other countries. Other names may be trademarks of their respective owners.
SOURCE: CyberOptics Semiconductor, Inc.