News | November 3, 2021

CyberOptics Receives Two Awards For New SQ3000+ Multi-Function And WX3000 Systems During SMTAI

MINNEAPOLIS--(BUSINESS WIRE)--

CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, received two 2021 Mexico Technology Awards in the categories of Inspection for its SQ3000+™ Multi-Function system for AOI, SPI and CMM, and Metrology for its WX3000™ Metrology and Inspection System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 at SMTA International in Minneapolis, MN.

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WX3000 Metrology and Inspection System for Wafer-level and Advanced Packaging. (Photo: Business Wire)

WX3000 Metrology and Inspection System for Wafer-level and Advanced Packaging. (Photo: Business Wire)

The SQ3000+ Multi-Function system for inspection and metrology is an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours. The new SQ3000+ offers a combination of unmatched high accuracy and high speed with an even higher resolution Multi-Reflection Suppression™ (MRS™) sensor that inhibits reflection-based distortions caused by shiny components and surfaces.

The SQ3000+ all-in-one system is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT for medical, military, aerospace and advanced electronics, 008004/0201 SPI, socket metrology and other advanced CMM applications.

“Whether it’s for wafer-level and advanced packaging, mini LEDs, or other evolving next-generation applications, the need for high performing metrology and inspection is increasing,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We’re honored to receive 2 awards for the best-in-class, superior performance of our latest 3D MRS sensor technology-based systems that enable our customers to recognize significant improvements in yields, throughput and processes.”

The 3 µm NanoResolution MRS sensor integrated into CyberOptics’ WX3000 Metrology and Inspection system provides sub-micrometer accuracy on features as small as 25µm. MRS rejects spurious multiple reflections from shiny and specular surfaces of solder balls, bumps and pillars, allowing highly accurate metrology and inspection of these critical packaging features. Fast, complete 100% 3D/2D inspection and bump metrology can be conducted with throughput greater than 25 wafers (300mm) per hour, at speeds 2-3X faster than alternative solutions.

The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers during the last 12 months. For more information, visit www.mexicoems.com/mta-awards.

For more information, visit www.cyberoptics.com.

About CyberOptics

CyberOptics Corporation ( www.cyberoptics.com ) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor markets to significantly improve yields and productivity. By leveraging its leading-edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: a possible worldwide recession or depression resulting from the economic consequences of the COVID-19 pandemic; the negative effect on our revenue and operating results of the COVID-19 crisis on our customers and suppliers and the global supply chain; market conditions in the global SMT and semiconductor capital equipment industries; trade relations between the United States and China and other countries; the timing of orders and shipments of our products, particularly our 3D MRS SQ3000 Multi-Function systems and MX systems for memory module inspection; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 Multi-Function systems and products for semiconductor inspection and metrology; costly and time consuming litigation with third parties related to intellectual property infringement; the negative impact on our customers and suppliers due to past and future terrorist threats and attacks and any acts of war; the impact of the MX3000 orders on our consolidated gross margin percentage in any future period; risks related to cancellation or renegotiation of orders we have received; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.

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