Rudolph's New MetaPULSE IIIa System Offers Higher Throughput And Lower CoO For DRAM Metrology Applications
San Francisco, CA - Rudolph Technologies, Inc, a worldwide leader in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry, recently introduced its new MetaPULSE IIIa thin film metrology tool, designed to provide reduced cost of ownership for film thickness measurements in aluminum-based DRAM manufacturing processes.
The MetaPULSE IIIa, the first of a new generation of inspection and metrology tools from Rudolph that will all share a common platform, is the latest iteration of the company's industry-standard picosecond ultrasonic laser sonar (PULSE) technology that provides high-volume, on-product thickness and material characterization for opaque (metal) films over the broadest range of types, dimensions and multilayered configurations. This new system delivers up to 25 percent greater throughput than the previous generation for significant reductions in cost of ownership (CoO). Rudolph has received multiple system orders from two major DRAM manufacturers in Taiwan.
"The 25 percent throughput increase, smaller spot size and higher magnification optics in the MetaPULSE IIIa clearly make it the best choice for fab-worthy measurements in DRAM and flash memory manufacturing process control for 80 and 65 nanometer devices today, as well as tomorrow's 45 and 32nm devices," said Brad Bartilson, manager of Rudolph's opaque metrology product line. "MetaPULSE is an industry-preferred technology for on-product measurements required for high-volume manufacturing. The new MP IIIa offers an even lower cost of ownership than previous MetaPULSE tools."
The MetaPULSE IIIa's throughput improvements result from a combination of hardware and software developments. A new higher magnification optical system provides better measurement location accuracy on finer features. A reduced spot size permits measurements of smaller test structures on product wafers. Matching and recipe compatibility with previous generation MetaPULSE tools preserve the customers investment and facilitate transition to the MetaPULSE IIIa. The new automation platform, which will become standard across all Rudolph inspection and metrology tools, delivers faster, more flexible wafer handling. Its Windows XP(TM) based operating system provides a familiar environment with easy networking and communications, and facilitates the use of current-generation, third-party software tools.
"The automation platform development is an example of the synergies emerging that benefit Rudolph's inspection and metrology customers," Bartilson added.
SOURCE: Rudolph Technologies