News | January 7, 2008

Emerging Lithography And Nanotechnology Highlight SPIE Advanced Lithography Program

Bellingham, WA — Micro- and nanolithography practitioners will share their up-to-the-minute research results and latest innovations at the SPIE Advanced Lithography conference in San Jose, CA, USA, in February. Topics range from state-of-the-art lithographic tools and technologies, resists, metrology, and materials characterization, to design and process integration, including progress of extending these technologies or switching to emerging alternatives. The event will be held 24-29 February 2008 in the San Jose Convention Center.

SPIE Advanced Lithography provides a rich networking opportunity for the international community and is known as a forum for high-quality technical presentations. More than 700 papers will be presented in five technical conferences. Of high interest are papers on nanoimprint, electron-beam direct write, parallel e-beam systems, extreme-UV systems, directed self assembly, molecular resists, EUV resists, double patterning, and high-index immersion lithography.

Three plenary talks are scheduled:

Martin van den Brink, Executive Vice President and Member of the Board of Management of ASML, will provide perspectives on what the chip and especially equipment industry needs to do in an environment where continued advances to the beat of Moore's law are becoming more and more difficult at increasingly higher costs.

Mark Durcan, President and COO of Micron Technology, will focus on how lithography options interact with memory device integration, and why future innovation is critical to the business of memory device manufacturing.

Andrew B. Kahng, Professor of Computer Science and Electrical Engineering at University of California, San Diego, will discuss how new roadmaps for partnership between lithography and design can guide semiconductor product teams in working through patterning, device, and circuit challenges with solutions such as software and 3D.

Expert panels will focus on topics including:

  • Photomask Financial Fears: Fact, Fiction or Fabrication?
  • Future Projection Lithography: Optical or EUV?
  • Massively Parallel Tools for Nanotechnology: Applications in Lithography and Metrology
  • Enabling Accurate Optical Proximity Correction
  • Reference Metrology

New courses on EUV lithography, double patterning, and electron-beam lithography and an expanded range of design for manufacturing (DfM) topics are among 27 courses and workshops offered on fundamentals and emerging approaches.

A two-day exhibition including approximately 120 companies will feature product demonstrations with question-and-answer sessions.

About SPIE
SPIE is an international society advancing an interdisciplinary approach to the science and application of light. Serving the interests of its more than 188,000 active constituents representing 138 different countries, SPIE acts as a catalyst for collaboration among technical disciplines for information exchange, continuing education, publishing opportunities, patent precedent, and career and professional growth. As the organizer and sponsor of approximately 26 major conferences and education programs annually in North America, Europe, Asia, and the South Pacific, SPIE provides publishing, speaking, and learning opportunities on emerging technologies.

SOURCE: SPIE

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